Loctite Encapsulants

Thermoset Encapsulants

Encapsulating materials are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the effects of exposure to chemicals, moisture, mechanical shock, and vibration.  Sealing components with encapsulants prevents corrosion and ensures long-term integrity of the device. 

The thermal properties of epoxy and silicone systems make them ideally suited for applications exposed to temperatures above 125°C.  If a soft, flexible material is needed, particularly at low temperatures, then a urethane or a silicone may be used.

Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.  Encapsulants improve assembly operations by providing superior reliability and faster throughput.  Improved reliability is achieved through products that have a high Tg, low CTE, high throughput, and excellent adhesion.  Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.

Available Products:

Loctite Encapsulants

Thermoset Encapsulants

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