CircuitSAF™ ME-455-1 is a low viscosity, one component, high purity, fast cure, semiconductor grade epoxy developed for the encapsulation of wire bonded and flip devices. ME-455-1 is a lower viscosity system than ME-455 and is ideally suited for use with closely spaced wire bonds and minimizes void formation by allowing the rapid release of air introduced during dispensing. ME-455-1 exhibits good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces.
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