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Available Products: CK-6009 – low viscosity, various colors epoxy encapsulant CK-6408 – low viscosity, flexible urethane encapsulant CK-6715 – condensed cure, no stress silicone encapsulant EP-697F – coil impregnating and encapsulation epoxy EP-729 – one component, fast curing glob-top epoxy EP-936 – one component fast cure epoxy encapsulant EP-937 – one component very fast curing epoxy encapsulant EP-939 – one component extra fast curing epoxy encapsulant LS213-9 – one component, unfilled moisture resistant epoxy ME-430 – high profile glob-top optoelectronic encapsulant ME-455 – high purity cavity fill chip-on-board encapsulant ME-455-1 – low viscosity, epoxy cavity-fill optical encaspulant ME-456 – high purity, fast cure, circuit assembly encapsulant ME-731 – one component silicone optoelectronic encapsulant SC-102 – unfilled, repairable, shock resistant silicone SC-300M – electronic grade silicone gel encapsulant SC-309 – thermally conductive silicone encapsulating system SC-314 – thermally conductive silicone encapsulant UR-312 – microelectronic grade clear urethane gel UR-325 – black, hydrolytic encapsulating system UR-329 – low modulus urethane encapsulating compound UR-340 – flexible, low viscosity urethane encapsulant
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