THERMOSET ENCAPSULANTS

 

CK-6009

CK-6408

CK-6715

EP-697F

EP-729

EP-936

EP-937

EP-939

LS213-9

ME-430

ME-455

ME-455-1

ME-456

ME-731

SC-102

SC-300M

SC-309

SC-314

UR-312

UR-325

UR-329

UR-340

Available Products:

CK-6009 – low viscosity, various colors epoxy encapsulant

CK-6408 – low viscosity, flexible urethane encapsulant

CK-6715 – condensed cure, no stress silicone encapsulant

EP-697F – coil impregnating and encapsulation epoxy

EP-729 – one component, fast curing glob-top epoxy

EP-936 – one component fast cure epoxy encapsulant

EP-937 – one component very fast curing epoxy encapsulant

EP-939 – one component extra fast curing epoxy encapsulant

LS213-9 – one component, unfilled moisture resistant epoxy

ME-430 – high profile glob-top optoelectronic encapsulant

ME-455 – high purity cavity fill chip-on-board encapsulant

ME-455-1 – low viscosity, epoxy cavity-fill optical encaspulant

ME-456 – high purity, fast cure, circuit assembly encapsulant

ME-731 – one component silicone optoelectronic encapsulant

SC-102 – unfilled, repairable, shock resistant silicone

SC-300M – electronic grade silicone gel encapsulant

SC-309 – thermally conductive silicone encapsulating system

SC-314 – thermally conductive silicone encapsulant

UR-312 – microelectronic grade clear urethane gel

UR-325 – black, hydrolytic encapsulating system

UR-329 – low modulus urethane encapsulating compound

UR-340 – flexible, low viscosity urethane encapsulant

 

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