UR-329 is a flexible, two-component, room temperature curing urethane encapsulating compound. It maintains low hardness and modulus over a wide temperature range, which imparts minimal stress on delicate electronic components. UR-329 is a filled system, which enhances its ability to dissipate heat. It is often suitable in applications operating up to 130°C. UR-329 also exhibits thermal shock resistance, very good electrical properties and good adhesion to a variety of materials.
Availability: