Thermoset UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal stress on delicate electronic components. UR-329 is a filled system, which enhances its ability to dissipate heat. It is often suitable in applications operating up to 130°C*. UR-329 also exhibits excellent thermal shock resistance, very good electrical properties and good adhesion to a variety of materials.
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