Hot melt adhesives bond a variety of substrates, including difficult-to-bond plastics. They can handle today’s toughest applications in a broad range of industries. Hot melts are ideal for applications that require high speed manufacturing, bonding versatility, very large gap filling, fast green strength and minimal shrinkage. They are solvent-free and contain environmentally responsible materials with no harmful volatile organic compounds (VOCs).
Polyamide hot melts are temperature and chemically resistant. Some formulations are modified with fire retardant materials and have a UL 94V-O flammability rating. Many low viscosity formulations are used for potting and encapsulation.
|Manufacturer||Product Name||Open Time||Temperature Resistance||Attributes|
|Loctite®||7804™ Hysol®||35 sec||220º F||High Viscosity|
|Loctite®||7809FR™ Hysol®||36 sec||240º F||Fire Retardant|
|Loctite®||7901™ Hysol®||37sec||300º F||High temperature; Potting|